We protect customers by carefully selecting suppliers and constantly evaluating them.  All the parts we sell are subject to a rigorous testing process and are checked by qualified electrical engineers.  Our professional qc team controls quality throughout the process, 

including delivery, storage and delivery.

Visual inspection of the vehicle
With the help of a stereomicroscope, the appearance of the parts is fully observed at 360 degrees. The primary focus of monitoring is the packaging of the product; Chip type, date, batch; Status of printing and packaging; External inspection allows you to quickly learn the requirements to meet the external requirements of the original brand manufacturer, antistatic electricity and humidity standards, as well as to use or restore.

Test of rations
This is not a fake detection method, because oxidation occurs naturally; However, it is an important functional issue, especially in hot and humid climates such as the southern states of south-east Asia and North America. The j-std-002 combined standard defines test methods and criteria for acceptance/rejection of devices with holes through, surface mounting and bga. For surface mounting devices other than bga with impregnation and appearance, "testing ceramic panels" of bga devices has recently been included in our service package. It is recommended that weldability tests be carried out with equipment which does not meet the packing requirements, acceptable packaging but is used for more than one year, or equipment which shows contamination in the conclusions

1. X-ray radiation
X-ray examination, 360-degree comprehensive observation of the parts to determine the internal structure of the measured parts and the condition of the packaging compound, you can see a large number of measured samples that are identical or mixed (mixed) with problems; In addition, they understand each other with specifications (data tables) to understand the validity of the samples tested. Check the state of the package connection to see if the connection between the chip and the package output is normal, except keys and short circuit.

Functional/software tests
Through official data tables, design of test projects, development of test panels, construction of test platforms, writing test programs, and then testing various IC functions. Professional and accurate testing of the chip function allows you to determine whether the IC function meets the standard. The types of IC that can now be tested include: logic devices, simulators, high frequency IC, power IC, various amplifiers and power IC control. Packages include dip, SOP, ssop, bga, sot, to-220, QFN, QFP, etc. We use software equipment to support testing 47,000 IC 208 models. Products include: eprom, parallel and serial eeprom, fpga, serial PROM configuration, flash memory, bprom, novram, SPLD, CPLD, epld, microcontrollers, MCU and standard logical device detection.